A HDB8259 HDEC Series Large Format Backplane provides a system integration methodology that enables many PCI Express 3.0 option cards to be attached to a single System Host Board. This configuration allows a single system to communicate with multiple devices at once, providing expanded system extensibility and versatility. The HDB8259 HDEC Series Large Format Backplane provides full implementation of the 80 lanes of PCI Express 3.0 provided by the dual Intel® Xeon® E5-2600 v3 or v4 series processors available on a HEP8225 HDEC Series system host board combined with 24-cores of processing capacity. The combination of backplane system integration capabilities and forward-thinking engineering enables innovative computing designs for today’s demanding embedded computing, big data and GPGPU Computing arenas. Key features of the HDB8259 HDEC Series Large Format Backplane include: